Hirose BM23PF0.8-46DS-0.35V 46 Positions 0.35mm 0.8mm Board-to-Board Receptacle
0.35mm46 Positions0.8mmReceptacle
46 Positions 0.35mm 0.8mm receptacle for dense board or module interconnects.
Verified Series DataBased on current Hirose documentation
Selection SupportConfirm mating part and packaging suffix
Technical Specifications
| Part Number | BM23PF0.8-46DS-0.35V |
| Series | BM23PF |
| Connector Type | Receptacle |
| Contact Pitch | 0.35mm |
| Number of Positions | 46 Positions |
| Rated Current | 5A |
| Rated Voltage | 30V AC/DC |
| Mounting Style | Vertical SMT |
| Mated Height | 0.8mm |
| Rows | Dual Row |
| Performance | USB 3.1 Gen 2, up to 10Gbps |
Key Features
- Rated current up to 5A
- Highly reliable contact design
- 0.8mm low mated height
- Supports USB 3.1 Gen 2 transmission
Applications
- High-density board-to-board or FPC-to-board connections requiring compact size, current capacity and up to 10Gbps transmission.
Drawing & Dimensions
Confirm the exact Hirose packaging/plating suffix and mating part before production release. Official source: https://www.hirose.com/en/product/series/BM23PF
BM23PF0.8-46DS-0.35V is the receptacle side of the Hirose BM23PF Series, providing 46 positions at 0.35mm pitch with a 0.8mm mated height. The configuration is intended for dense board or module interconnects; verify the corresponding mating half and packaging suffix before order release.
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