Hirose BM23PF0.8-50DP-0.35V 50 Positions 0.35mm 0.8mm Board-to-Board Plug
0.35mm50 Positions0.8mmPlug
50 Positions 0.35mm 0.8mm plug for dense board or module interconnects.
Verified Series DataBased on current Hirose documentation
Selection SupportConfirm mating part and packaging suffix
Technical Specifications
| Part Number | BM23PF0.8-50DP-0.35V |
| Series | BM23PF |
| Connector Type | Plug |
| Contact Pitch | 0.35mm |
| Number of Positions | 50 Positions |
| Rated Current | 5A |
| Rated Voltage | 30V AC/DC |
| Mounting Style | Vertical SMT |
| Mated Height | 0.8mm |
| Rows | Dual Row |
| Performance | USB 3.1 Gen 2, up to 10Gbps |
Key Features
- Rated current up to 5A
- Highly reliable contact design
- 0.8mm low mated height
- Supports USB 3.1 Gen 2 transmission
Applications
- High-density board-to-board or FPC-to-board connections requiring compact size, current capacity and up to 10Gbps transmission.
Drawing & Dimensions
Confirm the exact Hirose packaging/plating suffix and mating part before production release. Official source: https://www.hirose.com/en/product/series/BM23PF
BM23PF0.8-50DP-0.35V is the plug side of the Hirose BM23PF Series, providing 50 positions at 0.35mm pitch with a 0.8mm mated height. The configuration is intended for dense board or module interconnects; verify the corresponding mating half and packaging suffix before order release.
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