USB 3.1 Double-Layer + HDMI 2.1 Combo Connector – L000797
USB 3.110GbpsBoard-Mount
Built for industrial and commercial USB applications, this 3.1 Combo connector features double-layer board-mount construction with standard cable exit orientation. The standard...
3.1 Combo interface10Gbps SuperSpeed+ path
Double-layer PCB designDouble-row contact array
None° exit angleStandard cable exit
USB 3.1 Gen 2 compliantCompact board footprint
Technical Specifications
| USB Version | USB 3.1 |
| Connector Type | USB Connector |
| Mount Type | Board-Mount |
| Layers | Double-Layer |
| Orientation | 90 Degree |
| Pin Configuration | Standard |
| Rated Current | 4A |
| Rated Voltage | 30V DC |
| Data Speed | 10Gbps |
| Operating Temperature | -40C to +85C |
| Certifications | CE, RoHS, REACH |
Key Features
- USB 3.1 Combo connector supporting standard 3.1 data protocols
- Double-layer PCB design with None° cable exit for flexible board integration
- Standard contact configuration for full USB signaling compatibility
- Combo-port design consolidates multiple interfaces into a single PCB footprint
- Compatible with 3D printers, CNC controllers, and maker platforms
- Compatible with hand-soldering and reflow soldering processes for flexible production
Applications
- Consumer Electronics
- Computer Peripherals
- Industrial Control Systems
- Communication Devices
- Automotive Infotainment
- Medical Devices
- IoT Hardware
Product Drawing
Built for industrial and commercial USB applications, this 3.1 Combo connector features double-layer board-mount construction with standard cable exit orientation. The standard contact configuration supports full USB 3.1 signaling requirements for data and power delivery. The combo-port design consolidates multiple USB interface standards into a single PCB footprint, reducing board space and BOM complexity. Suitable for consumer electronics, industrial controls, and embedded computing platforms requiring USB interconnect. Each unit ships ready for board-mount installation with industry-standard pin pitch for drop-in compatibility with mainstream PCB assembly processes.
