Floating Board-to-Board Male Header 0.8mm 40Pin Double-Row SMT 6.8mm – B0802AV-220A-0CRB1

Floating BTB0.8mm40PinSMT8Gbps

40-position floating board-to-board male header, 0.8 mm pitch, double-row SMT, 6.8 mm height, 8 Gbps, 0.5 A, −40 °C to +125 °C.

8 Gbps data rateHigh-speed BTB interconnect
0.5 A per contactAu 3μ" plated copper alloy
6.8 mm stacking height0.8 mm pitch, double row
UL94 V-0 LCP−40 °C to +125 °C

Technical Specifications

Pitch0.80mm
Product SeriesFloating BTB Male, H6.8 Series
Product TypeFloating Board-to-Board Male (Plug)
GenderMale
Number of Positions40Pin
RowsDouble-Row
Orientation180 Degree (Vertical)
Mounting TypeSurface Mount (SMT)
Stacking Height (Plug H1)6.8mm
Mated Height (with receptacle)11.75mm
Data Rate8Gbps
Rated Current0.5A
Operating Temperature-40°C to +125°C
Insulator MaterialLCP, UL94V-0
Insulator ColorBlack
Contact MaterialCopper Alloy
Contact PlatingAu 3μ"
Shell / Solder Tab MaterialCopper Alloy
Shell / Solder Tab PlatingG/F (Gold Flash)
Body Length (Dim A)15.20mm
Body Width (Dim B)16.95mm
Overall Length (Dim D)20.30mm
Floating MechanismAbsorbs X/Y PCB placement tolerance
ComplianceUL94V-0

Key Features

  • 40-position floating board-to-board male header, 0.8 mm pitch
  • Floating structure absorbs PCB placement tolerance in the X and Y axes
  • Double-row SMT termination, 6.8 mm stacking height
  • Copper-alloy contacts with 3 μ" gold plating; shell gold-flash finished
  • 8 Gbps data rate for high-speed signal transmission
  • Black LCP housing rated UL94 V-0
  • Operating temperature range −40 °C to +125 °C
  • Rated 0.5 A per contact

Applications

  • Robotics joint modules
  • Industrial control and driver boards
  • Communication modules
  • Compact sensor and camera modules
Product Drawing
Floating Board-to-Board Male Header 0.8mm 40Pin Double-Row SMT 6.8mm – B0802AV-220A-0CRB1 drawing

B0802AV-220A-0CRB1 is a 40-position floating board-to-board male header with a 0.8 mm pitch, double-row SMT termination and a 6.8 mm stacked height. The floating mechanism absorbs PCB placement tolerance in the X and Y axes during automated assembly, which relieves stress on the solder joints and allows straight mating without a guide feature. Contacts are copper alloy finished with 3 μ” gold plating, and the shell and solder tabs are copper alloy with a gold-flash finish, rated 0.5 A per contact. The black LCP insulator meets UL94 V-0, and the series is specified for an 8 Gbps data rate over an operating temperature range of −40 °C to +125 °C. Typical applications include robotics joint modules, control and driver boards, and communication modules where a compact, tolerance-absorbing board-to-board link is required.