10Gbps USB 3.1 Raised Double-Layer Connector – C071365

USB 3.110GbpsBoard-Mount

Designed for OEM board-mount integration, this 3.1 Standard connector features double-layer board-mount construction with standard cable exit orientation. The standard contact...

3.1 Standard interface10Gbps Gen 2 transfer
Double-layer PCB designTwo-row PCB pin footprint
90° exit angleStandard cable exit
10Gbps SuperSpeed+ capableStandardized 0.1" pin pitch

Technical Specifications

USB VersionUSB 3.1
Connector TypeUSB Connector
Mount TypeBoard-Mount
LayersDouble-Layer
Orientation90 Degree
Pin ConfigurationStandard
Rated Current1.8A (0.25A for other contacts)
Rated Voltage30V DC
Contact Resistance30mΩ
Insulation Resistance100MΩ
Withstand Voltage100V
Contact MaterialU2 contacts: Phosphor Bronze, half gold-tin plated; U3 contacts: Brass, half gold-tin plated
Insulator MaterialHigh-Temperature Plastic, UL94-V0
Shell MaterialSUS, nickel plated
Data Speed10Gbps
Operating Temperature-55°C to +85°C
CertificationsCE, RoHS, REACH

Key Features

  • USB 3.1 Standard connector supporting standard 3.1 data protocols
  • Double-layer PCB design with 90° cable exit for flexible board integration
  • Standard contact configuration for full USB signaling compatibility
  • Raised contact geometry optimized for specific mating and retention requirements
  • Compact through-hole PCB footprint supports high-density board layouts
  • Compatible with 3D printers, CNC controllers, and maker platforms

Applications

  • Consumer Electronics
  • Computer Peripherals
  • Industrial Control Systems
  • Communication Devices
  • Automotive Infotainment
  • Medical Devices
  • IoT Hardware
Product Drawing
10Gbps USB 3.1 Raised Double-Layer Connector – C071365 drawing

Designed for OEM board-mount integration, this 3.1 Standard connector features double-layer board-mount construction with standard cable exit orientation. The standard contact configuration supports full USB 3.1 signaling requirements for data and power delivery. Polarized housing design ensures correct orientation during cable mating, reducing field service risk. Each unit ships ready for board-mount installation with industry-standard pin pitch for drop-in compatibility with mainstream PCB assembly processes.