3.0H No-Push Dual-layer SIM Card Connector – GSC-SIM-0013

3.0H No-Push Dual-layer SIM Card Connector – GSC-SIM-0013

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#Memory Card Connector#SIM Card
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3.0H No-Push Dual-layer SIM Card Connector, High Temperature Thermoplastic housing, Copper Alloy contacts, -40°C to +85°C. GSCONN part GSC-SIM-0013.

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Technical Specifications

TypeNo-Push
HousingHigh Temperature Thermoplastic
TerminalCopper Alloy
ShellStainless steel
Rated Voltage30V
Temperature-40°C to +85°C
Current Rating0.5 A
Insulation Resistance1000MΩ Min.
Contact Resistance100mΩ Max.
Withstand Voltage500V DC/Minute

Key Features

  • No-Push card insertion
  • High Temperature Thermoplastic housing
  • Copper Alloy contact system
  • Stainless steel shell
  • Rated 0.5 A
  • 30V rated voltage
  • 500V DC/Minute dielectric withstanding voltage
  • Contact resistance 100mΩ Max.

Applications

  • Mobile phones and tablets
  • Industrial handheld terminals
  • POS and payment terminals
  • Automotive telematics
Drawing & Dimensions
3.0H No-Push Dual-layer SIM Card Connector – GSC-SIM-0013 drawing

GSC-SIM-0013 is a No-Push connector. The housing is High Temperature Thermoplastic; the contact system is Copper Alloy; the shell is Stainless steel. Electrically it is rated 0.5 A, with a withstanding voltage of 30V, over an operating temperature range of -40°C to +85°C. Mechanically it offers insulation resistance 1000MΩ Min., contact resistance 100mΩ Max. Typical applications include Mobile phones and tablets, Industrial handheld terminals, POS and payment terminals, and Automotive telematics.

Type No-Push
Housing High Temperature Thermoplastic
Terminal Copper Alloy
Shell Stainless steel
Rated Voltage 30V
Temperature -40°C to +85°C
Current Rating 0.5 A
Insulation Resistance 1000MΩ Min.
Contact Resistance 100mΩ Max.
Withstand Voltage 500V DC/Minute

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