Extended USB 3.1 Double-Layer Rolled-Edge Connector – L000574

USB 3.110GbpsBoard-Mount

Precision-tooled for 3.1 data integrity, this 3.1 Standard connector features double-layer board-mount construction with standard cable exit orientation. The standard contact...

3.1 Standard interface10Gbps Gen 2 transfer
Double-layer PCB designTwo-row PCB pin footprint
90° exit angleStandard cable exit
10Gbps SuperSpeed+ capableHigh-density PCB layout

Technical Specifications

USB VersionUSB 3.1
Connector TypeUSB Connector
Mount TypeBoard-Mount
LayersDouble-Layer
Orientation90 Degree
Pin ConfigurationStandard
Rated Current1.8A (0.25A for other contacts)
Rated Voltage30V DC
Contact Resistance30mΩ
Insulation Resistance100MΩ
Withstand Voltage100V
Contact MaterialU2 contacts: Phosphor Bronze, half gold-tin plated; U3 contacts: Brass, half gold-tin plated
Insulator MaterialHigh-Temperature Plastic, UL94-V0
Shell MaterialSUS, nickel plated
Data Speed10Gbps
Operating Temperature-55°C to +85°C
CertificationsCE, RoHS, REACH

Key Features

  • USB 3.1 Standard connector supporting standard 3.1 data protocols
  • Double-layer PCB design with 90° cable exit for flexible board integration
  • Standard contact configuration for full USB signaling compatibility
  • Rolled-Edge contact geometry optimized for specific mating and retention requirements
  • Compatible with industrial robot and AGV system interconnect
  • Suitable for test equipment, instrumentation, and laboratory measurement

Applications

  • Consumer Electronics
  • Computer Peripherals
  • Industrial Control Systems
  • Communication Devices
  • Automotive Infotainment
  • Medical Devices
  • IoT Hardware
Product Drawing
Extended USB 3.1 Double-Layer Rolled-Edge Connector – L000574 drawing

Precision-tooled for 3.1 data integrity, this 3.1 Standard connector features double-layer board-mount construction with standard cable exit orientation. The standard contact configuration supports full USB 3.1 signaling requirements for data and power delivery. Compatible with hand-soldering, wave-soldering, and reflow-soldering processes for flexible production deployment. Each unit ships ready for board-mount installation with industry-standard pin pitch for drop-in compatibility with mainstream PCB assembly processes.