H3.0 no push dual-layer sim card connector – GSC-SIM-0014

H3.0 no push dual-layer sim card connector – GSC-SIM-0014

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#Memory Card Connector#SIM Card
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H3.0 no push dual-layer sim card connector, High Temperature, UL94V-0, Black housing, Copper Alloy contacts, -40°C~+85°C. GSCONN part GSC-SIM-0014.

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Technical Specifications

Typeno push
HousingHigh Temperature, UL94V-0, Black
TerminalCopper Alloy
ShellStainless steel
Rated Voltage30V
Operating Temperature-40°C~+85°C
Current Rating0.5 A
Insulation Resistance1000MΩ Min.
Contact Resistance100mΩ Max.
Withstand Voltage500VDC

Key Features

  • no push card insertion
  • High Temperature, UL94V-0, Black
  • Copper Alloy contact system
  • Stainless steel shell
  • Rated 0.5 A
  • 30V rated voltage
  • 500VDC dielectric withstanding voltage
  • Contact resistance 100mΩ Max.

Applications

  • Mobile phones and tablets
  • Industrial handheld terminals
  • POS and payment terminals
  • Automotive telematics
Drawing & Dimensions
H3.0 no push dual-layer sim card connector – GSC-SIM-0014 drawing

GSC-SIM-0014 is a no push connector. The housing is High Temperature, UL94V-0, Black; the contact system is Copper Alloy; the shell is Stainless steel. Electrically it is rated 0.5 A, with a withstanding voltage of 30V, over an operating temperature range of -40°C~+85°C. Mechanically it offers insulation resistance 1000MΩ Min., contact resistance 100mΩ Max. Typical applications include Mobile phones and tablets, Industrial handheld terminals, POS and payment terminals, and Automotive telematics.

Type no push
Housing High Temperature, UL94V-0, Black
Terminal Copper Alloy
Shell Stainless steel
Rated Voltage 30V
Operating Temperature -40°C~+85°C
Current Rating 0.5 A
Insulation Resistance 1000MΩ Min.
Contact Resistance 100mΩ Max.
Withstand Voltage 500VDC

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