Micro Sim Push H1.29 Card Connector – GSC-MSM-0002

Micro Sim Push Push H1.29 Card Connector, Hi-Temp Temperature, UL94V-0, Black housing, Copper Alloy contacts, -25°C to +85°C. GSCONN part GSC-MSM-0002.

Technical Specifications

TypePush-push
DimensionsL15.90xW15.0xH1.29mm
HousingHi-Temp Temperature, UL94V-0, Black
TerminalCopper Alloy
ShellStainless steel
Mating Cycles10000 Insertions
Temperature-25°C to +85°C
Current Rating0.5 AMP
Insulation Resistance500MΩ Min.
Contact Resistance100mΩ Max.
Dielectric Voltage500V AC/Minute

Key Features

  • Push-push card insertion
  • Dimensions L15.90xW15.0xH1.29mm
  • Hi-Temp Temperature, UL94V-0, Black
  • Copper Alloy contact system
  • Stainless steel shell
  • Rated 0.5 AMP
  • 500V AC/Minute dielectric withstanding voltage
  • Contact resistance 100mΩ Max.

Applications

  • Mobile phones and tablets
  • Industrial handheld terminals
  • POS and payment terminals
  • Automotive telematics
Drawing & Dimensions
Micro Sim Push H1.29 Card Connector – GSC-MSM-0002 drawing

GSC-MSM-0002 is a Push-push connector. The housing is Hi-Temp Temperature, UL94V-0, Black; the contact system is Copper Alloy; the shell is Stainless steel. Electrically it is rated 0.5 AMP, with a withstanding voltage of 500V AC/Minute, over an operating temperature range of -25°C to +85°C. Mechanically it offers mating durability of 10000 Insertions, insulation resistance 500MΩ Min., contact resistance 100mΩ Max. Typical applications include Mobile phones and tablets, Industrial handheld terminals, POS and payment terminals, and Automotive telematics.

Type Push-push
Dimensions L15.90xW15.0xH1.29mm
Housing Hi-Temp Temperature, UL94V-0, Black
Terminal Copper Alloy
Shell Stainless steel
Mating Cycles 10000 Insertions
Temperature -25°C to +85°C
Current Rating 0.5 AMP
Insulation Resistance 500MΩ Min.
Contact Resistance 100mΩ Max.
Dielectric Voltage 500V AC/Minute