
USB 3.1 Double-Layer Bent-Pin Connector – C071299
USB 3.110GbpsBoard-Mount
Designed for OEM board-mount integration, this 3.1 Standard connector features double-layer board-mount construction with standard cable exit orientation. The standard contact...
3.1 Standard interface10Gbps Gen 2 transfer
Double-layer PCB designTwo-row PCB pin footprint
90° exit angleStandard cable exit
10Gbps SuperSpeed+ capableStandard 2.54mm pitch profile
Technical Specifications
| USB Version | USB 3.1 |
| Connector Type | USB Connector |
| Mount Type | Board-Mount |
| Layers | Double-Layer |
| Orientation | 90 Degree |
| Pin Configuration | Standard |
| Rated Current | 1.8A (0.25A for other contacts) |
| Rated Voltage | 30V DC |
| Contact Resistance | 30mΩ |
| Insulation Resistance | 100MΩ |
| Withstand Voltage | 100V |
| Contact Material | U2 contacts: Phosphor Bronze, half gold-tin plated; U3 contacts: Brass, half gold-tin plated |
| Insulator Material | PBT/High-Temperature Plastic, UL94-V0 |
| Shell Material | SUS, nickel plated |
| Data Speed | 10Gbps |
| Operating Temperature | -55°C to +85°C |
| Certifications | CE, RoHS, REACH |
Key Features
- USB 3.1 Standard connector supporting standard 3.1 data protocols
- Double-layer PCB design with 90° cable exit for flexible board integration
- Standard contact configuration for full USB signaling compatibility
- Bent-Pin contact geometry optimized for specific mating and retention requirements
- Suitable for IoT gateway and edge-computing data acquisition
- Operating temperature -40°C to +85°C for industrial and automotive deployment
Applications
- Consumer Electronics
- Computer Peripherals
- Industrial Control Systems
- Communication Devices
- Automotive Infotainment
- Medical Devices
- IoT Hardware
Product Drawing

Designed for OEM board-mount integration, this 3.1 Standard connector features double-layer board-mount construction with standard cable exit orientation. The standard contact configuration supports full USB 3.1 signaling requirements for data and power delivery. Operating temperature range supports -40°C to +85°C industrial deployment across harsh environments. Each unit ships ready for board-mount installation with industry-standard pin pitch for drop-in compatibility with mainstream PCB assembly processes.



