USB 3.1 Quad-Layer 90 Degree Bent-Pin Connector – C071070

USB 3.110GbpsBoard-Mount

Engineered for high-reliability USB interconnect, this 3.1 Standard connector features quad-layer high-density construction with right-angle cable exit for horizontal board...

3.1 Standard interface10Gbps SuperSpeed+ rate
Quad-layer PCB designQuad-stack high-density design
90° exit anglePerpendicular PCB exit
USB 3.1 Gen 2 certifiedCompact board footprint

Technical Specifications

USB VersionUSB 3.1
Connector TypeUSB Connector
Mount TypeBoard-Mount
LayersQuad-Layer
Orientation90 Degree
Pin ConfigurationStandard
Rated Current1.8A (0.25A for other contacts)
Rated Voltage30V DC
Contact Resistance30mΩ
Insulation Resistance100MΩ
Withstand Voltage100V
Contact MaterialU2 contacts: Phosphor Bronze, half gold-tin plated; U3 contacts: Brass, half gold-tin plated
Insulator MaterialHigh-Temperature Plastic, UL94-V0
Shell MaterialSUS, nickel plated
Data Speed10Gbps
Operating Temperature-55°C to +85°C
CertificationsCE, RoHS, REACH

Key Features

  • USB 3.1 Standard connector supporting standard 3.1 data protocols
  • Quad-layer PCB design with 90° cable exit for flexible board integration
  • Standard contact configuration for full USB signaling compatibility
  • Bent-Pin contact geometry optimized for specific mating and retention requirements
  • Compatible with standard USB cable assemblies for plug-and-play deployment
  • Suitable for IoT gateway and edge-computing data acquisition

Applications

  • Consumer Electronics
  • Computer Peripherals
  • Industrial Control Systems
  • Communication Devices
  • Automotive Infotainment
  • Medical Devices
  • IoT Hardware
Product Drawing
USB 3.1 Quad-Layer 90 Degree Bent-Pin Connector – C071070 drawing

Engineered for high-reliability USB interconnect, this 3.1 Standard connector features quad-layer high-density construction with right-angle cable exit for horizontal board integration. The standard contact configuration supports full USB 3.1 signaling requirements for data and power delivery. PA66 + glass-fiber reinforced housing provides mechanical strength and heat resistance for long-term reliability. Each unit ships ready for board-mount installation with industry-standard pin pitch for drop-in compatibility with mainstream PCB assembly processes.