USB 3.1 Single-Layer 90 Degree Straight-Pin Connector – C071377

USB 3.110GbpsBoard-Mount

Designed for OEM board-mount integration, this 3.1 Standard connector features single-layer board-mount construction with right-angle cable exit for horizontal board integration....

3.1 Standard interface10Gbps Gen 2 transfer
Single-layer PCB designSingle-row straight pin layout
90° exit angleRight-angle cable exit
10Gbps SuperSpeed+ capableStandard 2.54mm pitch profile

Technical Specifications

USB VersionUSB 3.1
Connector TypeUSB Connector
Mount TypeBoard-Mount
LayersSingle-Layer
Orientation90 Degree
Pin ConfigurationStandard
Rated Current1.8A (0.25A for other contacts)
Rated Voltage30V DC
Contact Resistance30mΩ
Insulation Resistance100MΩ
Withstand Voltage100V
Contact MaterialU2 contacts: Phosphor Bronze, half gold-tin plated; U3 contacts: Brass, half gold-tin plated
Insulator MaterialHigh-Temperature Plastic, UL94-V0
Shell MaterialSUS, nickel plated
Data Speed10Gbps
Operating Temperature-55°C to +85°C
CertificationsCE, RoHS, REACH

Key Features

  • USB 3.1 Standard connector supporting standard 3.1 data protocols
  • Single-layer PCB design with 90° cable exit for flexible board integration
  • Standard contact configuration for full USB signaling compatibility
  • Straight-Pin contact geometry optimized for specific mating and retention requirements
  • PA66 + glass-fiber reinforced housing for mechanical strength and heat resistance
  • Compatible with industrial HMIs, control panels, and operator interfaces

Applications

  • Consumer Electronics
  • Computer Peripherals
  • Industrial Control Systems
  • Communication Devices
  • Automotive Infotainment
  • Medical Devices
  • IoT Hardware
Product Drawing
USB 3.1 Single-Layer 90 Degree Straight-Pin Connector – C071377 drawing

Designed for OEM board-mount integration, this 3.1 Standard connector features single-layer board-mount construction with right-angle cable exit for horizontal board integration. The standard contact configuration supports full USB 3.1 signaling requirements for data and power delivery. PA66 + glass-fiber reinforced housing provides mechanical strength and heat resistance for long-term reliability. Each unit ships ready for board-mount installation with industry-standard pin pitch for drop-in compatibility with mainstream PCB assembly processes.