
USB 3.1 Single-Layer + HDMI 2.1 Combo Connector – L000703
Optimized for compact PCB footprint designs, this 3.1 Combo connector features single-layer board-mount construction with standard cable exit orientation. The standard contact...
Technical Specifications
| USB Version | USB 3.1 |
| Connector Type | USB Connector |
| Mount Type | Board-Mount |
| Layers | Single-Layer |
| Orientation | 90 Degree |
| Pin Configuration | Standard |
| Rated Current | 1.8A (0.25A for other contacts) |
| Rated Voltage | 30V DC |
| Contact Resistance | 30mΩ |
| Insulation Resistance | 100MΩ |
| Withstand Voltage | 100V |
| Contact Material | Brass, half gold-tin plated |
| Insulator Material | PBT+LCP, UL94-V0 |
| Shell Material | SUS, nickel plated |
| Data Speed | 10Gbps |
| Operating Temperature | -55°C to +85°C |
| Certifications | CE, RoHS, REACH |
Key Features
- USB 3.1 Combo connector supporting standard 3.1 data protocols
- Single-layer PCB design with 90° cable exit for flexible board integration
- Standard contact configuration for full USB signaling compatibility
- Combo-port design consolidates multiple interfaces into a single PCB footprint
- Suitable for digital signage, kiosks, and information display systems
- Robust mechanical structure for reliable mating-cycle durability
Applications
- Consumer Electronics
- Computer Peripherals
- Industrial Control Systems
- Communication Devices
- Automotive Infotainment
- Medical Devices
- IoT Hardware

Optimized for compact PCB footprint designs, this 3.1 Combo connector features single-layer board-mount construction with standard cable exit orientation. The standard contact configuration supports full USB 3.1 signaling requirements for data and power delivery. The combo-port design consolidates multiple USB interface standards into a single PCB footprint, reducing board space and BOM complexity. Polarized housing design ensures correct orientation during cable mating, reducing field service risk. Each unit ships ready for board-mount installation with industry-standard pin pitch for drop-in compatibility with mainstream PCB assembly processes.



